PCB Assembly: From Proto to Mass Production
Surface mount (SMT), through-hole (THT), and mixed-technology PCB assembly. We handle BGA, microBGA, CGA, flip chip, 01005 passives, and RF boards, with in-circuit test and X-ray inspection in-house.
Engagement models: Consignment, turnkey, or hybrid
SMT Process Window
San Diego
| Parameter | Capability |
|---|---|
| Minimum component size | 0.4 × 0.2 mm (01005) |
| Minimum pitch, QFP / TSOP | 0.3 – 0.4 mm |
| Minimum pitch, µBGA | 0.35 mm |
| Equipment board-size limits | Placement: 50 × 50 mm to 510 × 460 mmPrinting maximum: 508 × 508 mm. Confirm complete-process limits with engineering. |
| Solder paste inspection | 3D, 14 µm |
| SMT lines, San Diego | 3 |
Board-Level Technologies
SMT Placement
High-speed fine pitch
Through-Hole
Wave & manual solder
BGA / microBGA
CGA • Flip Chip
01005 Passives
0.35mm microBGA • DFx
RF Technology
Digital • analog • RF boards
Leaded & Lead-Free
Both alloy systems in-house
OUR EQUIPMENT
San Diego Equipment
Surface mount, through-hole, press-fit, dispensing, serialization and testing equipment at our San Diego operation, with 56,000 sq. ft. across the main building and warehouse.
SMT Placement & Soldering
- Panasonic CM602 Platform SMT Lines
- Three CM602 platform lines with high-flexibility, multi-functional and high-speed heads. Fine-pitch placement down to 01005 passives and 0.35mm pitch microBGA, CGA and flip chip, with DEK Horizon 03i screen printing.
- Leaded & Lead-Free Processing
- Both leaded and lead-free assembly are run in-house: the Kurtz Ersa EcoSelect 2 carries a dual solder pot (lead-free and leaded) for selective soldering, alongside the lead-free wave line.
- Screen Printing
- DEK Horizon 03i screen printers on every line. 508 x 508mm maximum board, 0.5 to 3mm fiducials, 2D vision system with multi-fiducial shape recognition, board edge clamping, automatic squeegee-level and rail-width adjustment.
- 3D Solder Paste Inspection
- TRI TR7007 with 4MP color camera at 14 µm optical resolution. Measures paste height, area, volume and offset, and detects insufficient or excessive solder, deformity, missing paste and bridging before placement.
- Reflow Profiling
- Heller 2039MK5 with 12 heated and 3 cooling convection zones. Operating profiles are built in KIC K2 profiling software; Vitronics Soltec reflow ovens run the remaining lines.
- Wave & Selective Soldering
- Vitronics Soltec Delta 5 with lead-free pot, dual spray nozzle and recipe-driven flux tank selection for wave soldering. Kurtz Ersa EcoSelect 2 with dual solder pot (lead-free and leaded) and a fluxer module with precision spray fluxer for selective soldering.
Inspection, Test & 3D Diagnostics
- In-Circuit Test (ICT)
- KEYSIGHT i3070 Series 6 in-circuit test system for resistor, capacitor, inductor, diode and transistor testing, shorts and opens detection, polarity checking and boundary-scan test.
- Flying Probe
- TAKAYA APT-1600FD dual-side flying probe tester. 540 x 483mm test area, 0.6-5.0mm board thickness, 1.25 µm XY position resolution, with color vision inspection.
- X-Ray Inspection
- X-TEX XTV 160 X-ray with 5-axis manipulator, 160 kV max and 3D CT scanning. Creative Electron TruView Novus for 2D, 2.5D and 3D offline inspection, 5 µm minimum focal spot with tilt to 60 degrees.
- Automated Optical Inspection
- TRI TR7710 and TR7500 in-line AOI across the SMT lines, checking component presence, shift, skew, tombstone, billboard, polarity and solder joint quality on 01005 chips and 0.4mm pitch leads.
- Microscopic Inspection
- Vision Engineering Mantis 9135956 and Mantis Elite HD stereo microscopes with Scienscope VIZOR-A for high-magnification optical inspection of accessible components and solder joints.
- Metrology
- KEYENCE IM-X1540 image dimension measurement system. 200mm Z-stage travel; touch-probe compatible. Contact engineering for measurement accuracy and conditions for your application.
- PCBA Thermal Shock
- PCBA thermal shock is part of our test capability. Contact our engineering team to review your program’s test requirements.
Cleaning & Dispensing
- Aqueous Cleaning
- Typhoon T12 Aqua Kleen system with touch-screen wash and rinse temperature control, upper and lower air knife, rotatory custom dry system and closed-loop recirculation.
- Dispensing Material
- PVA Delta 6 dispensing cell. 521 x 485 x 100mm work area, ±25 µm XYZ repeatability at 5 µm resolution, closed-loop three-axis motion, running under-fill, dam-and-fill, glob top and surface-mount adhesive from one cell.
Assembly & Serialization
- Press-Fit
- TE Connectivity CMP-5T MK II manual electric servo press. 44 kN (5 tons) force, 610 x 915mm PCB capacity, insertion-force monitoring, SPC force monitoring and traceability, and SensiPress pin defect detection.
- PCB Laser Marking
- HGTECH LCD-10C single-head laser marking machine for bare-board serialization. 510 x 460mm maximum PCB size, 10-watt CO2 laser source, and DXF / GBR file compatibility.
Materials Infrastructure
- On-Site Vendor-Managed Inventory (VMI)
- Strategic distribution partners maintain on-site stores managed by dedicated resident vendor personnel.
- Enterprise MRP
- CCSD ERP system manufacturing management with Master Schedule and Material Requirement Planning (MRP).
- Automated Quoting
- Polydyne QuoteWin material quoting system for rapid, accurate BOM turnarounds.
- Floor Tracking
- Real-time bar code-based WIP system enforcing single-piece flow interlocks.
- Tape & Reel
- In-house flexible tape-and-reel capabilities for bulk semiconductor packaging.
Need SMT or PCB Assembly?
Email our engineering and sales team. DFM reviews and program quotes are handled under mutual NDA.
EMAIL OUR PCBA TEAM